New: Duronaut Pro & Hydronaut Pro

Compared to their non-pro variants, Duronaut Pro and Hydronaut Pro offer increased thermal conductivity while otherwise meeting the specific requirements of their predecessors. Duronaut Pro was developed for particularly high long-term stability, while Hydronaut Pro can be used as a thermal paste in industrial systems thanks to its silicone-free carrier structure.

At first glance, the temperature differences measured under laboratory conditions between the Pro pastes and the non-pro variants appear marginal. However, when considering how little room for improvement still exists in thermal paste development with regard to temperature, these improvements in thermal conductivity must be considered significant. 

In the following graphics, thermal conductivity is given as the temperature difference (delta Kelvin) between the heat source (30 x 30 mm contact surface, 240 watts heat flow) and the cooler (contact pressure: 300 N force (48 PSI)). The lower the value, the better the thermal conductivity. Specifying the temperature delta while taking contact pressure into account is a more accurate comparison method for thermal pastes than stating thermal conductivity in watts per meter and Kelvin (W/(m × K)).

Duronaut Pro is a high-end thermal paste whose development focused not only on optimizing thermal conductivity compared to Duronaut, but also on achieving exceptionally high long-term stability. The name “Duronaut” is derived from the English term “durability.” This exceptionally high long-term stability is achieved through a specially developed silicone oil as well as the combination of aluminum micropowder and zinc oxide nanopowder in different forms. The optimized particle shape and size minimize the so-called pump-out effect and ensure excellent adhesion of the paste to the surface. This results in an extremely low thermal contact resistance.

The pump-out effect describes the expulsion of thermal paste due to temperature fluctuations, such as those that can occur between the heatspreader and CPU cooler. While this effect is less pronounced at low temperatures, it increases significantly at high temperatures. This is particularly critical in components made of different materials with differing coefficients of thermal expansion, for example between a silicon chip, such as in GPUs, and a copper heatsink.

The exceptional thermal conductivity of Duronaut Pro is achieved through a specially developed silicone matrix used as the carrier material, which is filled with a high proportion of thermally conductive micro- and nanoparticles. Thanks to the small particle size, Duronaut Pro achieves an extremely thin bond line in application. This combination of minimal bond-line thickness and highly conductive fillers gives Duronaut Pro outstanding overall performance.

For optimal application of Duronaut Pro, the high-end thermal paste includes the TG Spatula Pro. The revised spatula design makes it possible to apply more pressure to the surface during application. This allows the thermal paste to be applied more efficiently and in a thinner layer.

Short Information

• Extreme long-term stability
• Outstanding thermal conductivity
• Electrically non-conductive
• No curing

Hydronaut Pro is a silicone-free thermal paste with an optimized formulation that is suitable for use in both industrial systems and high-performance PC systems. Thanks to its outstanding thermal conductivity, it is particularly well suited for applications with large-surface heat sinks, such as gaming PCs with custom water cooling. Hydronaut Pro is also suitable for overclocked processors or processors with a high TDP in watts (Intel Core i5/i7, AMD Ryzen 5/7). Hydronaut Pro combines high performance with an attractive price-performance ratio and is also designed for overclocking applications.

Silicone-Free for Industrial Systems

Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, silicone-based oils (e.g., siloxanes) are used as the carrier fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect.

In normal PC use, this is generally uncritical. In industrial applications, however, leaking silicone-based oil may be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties. The product is RoHS compliant and designed as an easy-to-apply thermal interface material for demanding users.

Key Information

• Suitable for industrial applications
• Outstanding thermal conductivity
• No curing
• Silicone-free
• Electrically non-conductive

QUALITY WITHOUT COMPROMISE

Thermal Grizzly Holding GmbH is a German-based company renowned for producing high-perfromance cooling solutions and accessories designed for PC enthusiasts. The company is driven by innovation and is led by its founder and CEO Eike Salow, and CEO Roman “der8auer” Hartung, a mechatronics engineer and renowned figure in the overclocking community. With a focus on maximizing system performance, Thermal Grizzly’s engineers and designers constantly work on developing cutting-edge products. Company’s headquarters in Hohen Neuendorf, Brandenburg, not only serves as the research and development hub but also houses advanced production equipment, such as precision CNC milling machines. Thermal Grizzly products are distributed worldwide through Thermal Grizzly Shop GmbH, based in Lippstadt, Germany, and Partner Reseller Network, ensuring global availability for PC enthusiasts.